| Paramèter | Kapabilitas |
| Tipe Majelis | Through-Hole (THT), Surface Mount (SMT), Campuran (THT+SMT) |
| Ukuran Komponen Minimal | 0201 |
| Ukuran Komponen Maksimum | 2,0 in x 2,0 in x 0,4 in (50 mm x 50 mm x 10 mm) |
| Jinis Paket Komponen | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, lsp. |
| Pitch Pad Minimal | 0,5 mm (20 mil) kanggo QFP, QFN, 0,8 mm (32 mil) kanggo BGA |
| Materi Papan | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, Frekuensi Dhuwur, FPC, Rigid-Flex, Rogers, lsp. |
| Lumahing Rampung | OSP, HASL, Flash Gold, ENIG, Gold Finger, lsp. |
| Jinis Tempel Solder | Timbal utawa Lead-Free |
| Proses Majelis | Reflow Soldering, Gelombang Soldering, Manual Soldering |
| Metode Inspeksi | Inspeksi Optik Otomatis (AOI), X-ray, Inspeksi Visual |
| Metode Pengujian In-House | Tes Fungsional, Tes Probe, Tes Tuwa, Tes Suhu & Kelembapan Dhuwur lan Sedheng |
| Wektu Turnaround | Sampling: 24 jam nganti 7 dina, Mass Run: 10 - 30 dina |
| Standar Majelis PCB | ISO9001:2015; ROHS, UL 94V0, IPC-610E kelas ll |



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